Substrate processing, substrate bonding
This is the process being carried out at our company.
As part of the processing steps for electronic devices utilizing ICs that our company conducts, we follow the procedures below: ○ Die bonding ←→ Adhesion of IC to substrate ○ Wire bonding ←→ Connection between substrate and IC using gold wire ○ Wire inspection ←→ Inspection of bonding errors and loop shape ○ Encapsulation potting ←→ Protection of IC and gold wire ○ Electrical characteristic inspection ←→ After soldering or after assembly ○ Soldering ←→ Soldering by reflow, dipping, or hand soldering ○ Thermal compression bonding ←→ Heat sealing, connection of flex ○ Assembly ←→ Various types of assembly ○ Packaging In each step of the process, we always tailor the selection of materials, plating thickness, types of equipment, and appearance standards to meet our customers' needs.
- Company：芳賀精密工業
- Price：Other
